Printed Circuit Board Manufacturing Capabilities Summary
Capabilities
We have extensive SMT/SMD assembly capabilities through-hole and mixed technology PCB assemblies. BGA down to 0.25mm pitch, 0201 component placements, and leadless devices assembly can also be available. High-speed advanced Fuji SMT machines can well support your strict requirements of PCB assembly, whatever concerning mil-spec, network, communication, health care, medical, musical instrument discuss the application. In terms of pass rate, we have done 99.9%. Our engineering team will discuss the assembly manufacturing process once we get your order. We will figure out the best work plan, and your PCBs are performed in quality online.
A full range of PCB manufacturing and assembly services fits all of your printed circuit board capability needs. We are a one-stop printed circuit board manufacturer with a quick-turn PCB assembly solution. Offering some of the most advanced PCB technology and convenient services in the industry: Full Spec PCBs, Small Quantity – Quick Turn PCBs, Custom Spec – Quick Turn PCBs, Highly Specialized Precision PCBs, Large Scale Production (No order is too small or too large.
| Feature | 2017 | |
| Standard | Advanced | |
| Materials | RIGID: FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave FLEX: IMS: Please contact us for full details regarding material availability | RIGID: Mid – Loss material TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low – Loss material Ultra Low – Loss material Super Low – Loss material and High Thermal Reliability Laminate FLEX: IMS: Please contact us for full details regarding material availability |
| Minimum dielectric thickness | 0.05mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.012mm for FPC |
| Layer count | 1 – 38L / 40L QTA | 64L (pilot runs) |
| HDI / Buried – blind via | Y | Y |
| Copper filled BVH (Y/N) | Y | Y |
| Copper filled PTH (Y/N) | Y | Y – copper paste |
| Copper paste filled PTH (Y/N) | Y | Y |
| Capped via (Y/N) | Y | Y |
| LDI (Y/N) | Y | Y |
| Maximum board size (mm) | 1050 x 610 | 1400 x 610 |
| Minimum board thickness (mm) 2L | 0.15 for PCB 0.05 for 1L FPC 0.12 for 2L FPC | 0.15 for PCB 0.05 for 1L FPC 0.12 for 2L FPC |
| Minimum board thickness (mm) ≥4L | 0.25 for PCB 0.20 for FPC | 0.25 for PCB 0.16 for FCP |
| Maximum board thickness (mm) | 8.6 | 10.0 |
| Minimum track / gap IL (mil)- copper weight dependant | 0.075mm | 0.05mm |
| Minimum track / gap OL (mil)- copper weight dependant | 0.075mm | 0.05mm |
| Surface finish | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF |
| Layer to layer registration | 0.05mm | 25μm |
| Minimum hole (mech) (mm/mil) | 0.15mm | 0.1mm |
| Minimum hole (laser) (mm/mil) | 0.075 | 0,05 |
| Aspect ratio PTH | 15:1 | 20:1 |
| Aspect ration BVH | 0.8:1 | 1.3:1 (factory + design dependent) |
| Finish hole tolerance (PTH) | ± 0.076mm | ± 0.05mm |
| Finish hole tolerance (NPTH) | ±0.0375 | ±0.025 |
| Maximum Cu weight OL | 12oz | 12oz |
| Maximum Cu weight IL | 12oz | 12oz |
| Controlled impedance (+/- X%) | Others ± 10% | ± 5% |
| Rigid-flex (Y/N) | Y | Y including semi flex |
| Flexible (Y/N) | Y | Y |
| IMS (Y/N) | Y (Al) | Y (both Al and Cu) |
| Embedded components (Y/N) | Y | Y |
| Soldermask via plugging IPC4761 Type VI (Y/N) | Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y |
